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Highspeed design – stackup and return path

Are you tired of working with high speeds and still experiencing signal issues?

Let’s be honest – it can be frustrating and time-consuming. But it doesn’t have to be that way! The right PCB stack-up is crucial for achieving successful high-speed design and avoiding EMI problems. If a designer can get a stackup right, routing with assured signal integrity becomes much easier, and many of the simpler EMI problems will be avoided.

That’s why it’s important to understand how a stack-up works and how to optimize it for high speed design. In this webinar, we’ll provide you with the necessary tools and tips to improve your design and increase the chances of successful implementation. We’ll also discuss return paths, which are another crucial factor for signal integrity, and how to avoid pitfalls and improve results.

Join our webinar and learn how to optimize your stackup and return paths to avoid signal issues and minimize EMI challenges in your high speed design.

This is a unique opportunity to improve your design skills and increase the chances of successfully implementing modern high-speed interfaces, such as DDR and serial links.

We look forward to seeing you there!

Speakers

Søren Jul Christiansen
Senior Application Engineer
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