WEBINAR | RF: Addressing Performance and Reliability Concerns with Thermal Analysis for RF Power Applications

In RF power design, heat is rarely a surprise. The cost is. In a GaN PA, self-heating can pull PAE down from 72 to 65 percent and cost almost 1 dB of gain, and lifetime drops sharply as channel temperature rises. Yet thermal analysis is often done late, or by another team, because data has to move between tools. Each round takes one to two weeks, and if the problem only shows up after manufacturing, it means a respin measured in months.

In this webinar, Andy Wallace from Cadence shows how RF engineers can run their own thermal analysis with Celsius Thermal Solver directly in Microwave Office, using the layout, stackup and power dissipation already in the design.

In the webinar, you will learn:

• what heat does to performance and lifetime in RF power amplifiers
• why thermal analysis rarely happens in the design phase today
• how Microwave Office and Celsius work together without re-entering design data
• what the setup looks like: heat sources, thermal stackup and extraction block
• what thermal vias and a heatsink do to temperature in an MMIC GaN PA in a QFN package
• how it works in practice

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** The webinar will be held in English.