When PCB designs move into mechanical reality, assumptions quickly become expensive. NEXTRA gives you a shared 3D environment for validating PCB designs against the actual mechanical context—before integration issues reach production.
Electrical and mechanical designs are often developed in parallel—but validated separately.
That works until the PCB must fit the final product.
These situations are rarely caused by poor engineering.
They happen because ECAD and MCAD decisions are typically reviewed too late in the process.
NEXTRA helps engineering teams validate designs in a shared 3D context before integration problems become redesigns.
NEXTRA combines ECAD–MCAD integration with specialized 3D PCB validation capabilities.
Most teams start by validating enclosure fit and design alignment, then expand into more advanced analysis as design complexity increases. NEXTRA is modular, so you can build a setup that matches your needs.
NEXTRA® Creepage analyzes creepage paths across insulating surfaces in 3D electro-mechanical assemblies.
The module identifies where electrical current may travel along material surfaces between conductive elements — helping engineering teams validate creepage distances in high-voltage designs before certification.
This helps teams:
Especially relevant in high-voltage products where insulating surfaces are exposed to contamination, humidity, or demanding operating conditions.
NEXTRA® Clearance Analysis validates minimum air clearances between conductive elements in 3D electro-mechanical assemblies.
By combining electrical connectivity with mechanical geometry, the module identifies spacing violations between PCBs, housings, connectors, and surrounding conductive elements.
This helps engineering teams:
Particularly relevant in compact, high-voltage, or mechanically constrained products where electrical spacing must remain compliant under real assembly conditions.
NEXTRA® Flashthrough Analysis evaluates insulation distances through materials in 3D electro-mechanical assemblies.
The module helps identify situations where voltage may break through insulating elements between conductive parts — a critical consideration in high-voltage and safety-sensitive designs.
This helps engineering teams:
Especially valuable in products where insulation integrity is critical to operational safety and long-term reliability.
NEXTRA® MID Technology supports the design and routing of Molded Interconnect Devices (MID) directly on three-dimensional surfaces.
Instead of treating electronics and mechanics as separate elements, MID technology allows conductive circuitry and electronic components to become part of the mechanical structure itself.
This helps engineering teams:
Especially relevant in compact electronic products where mechanical integration, space optimization, and functional integration are critical design requirements.
NEXTRA® Multi Design allows multiple PCB layouts to be assembled, positioned, and analyzed together within a shared 3D environment.
Instead of reviewing boards individually, engineering teams can validate how multiple PCB designs interact mechanically and electrically as part of the complete product assembly.
This helps engineering teams:
Especially relevant in complex electronic systems where multiple PCBs must coexist within tight mechanical constraints or shared enclosures.
All Nordcad customers have access to our local hotline support. Here you speak with a technical specialist who understands your challenges and can guide you quickly.
“It ensures fast help, eliminating the time-consuming process of seeking assistance through conventional channels.”
In short: Mecadtron NEXTRA provides the platform. Nordcad makes it useful in your daily practice.
A short conversation is often enough to determine whether Nordcad is the right fit. No pitch. No pressure.
Just an open discussion about your needs and challenges.
